Versatile Dual-Sided Power Distribution Board

Get reliable power distribution with our Versatile Dual-Sided Power Distribution Board. We are a factory specializing in high-quality electrical products."
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PRODUCTS DETAILS

Basic Info.

Production Process
Semi-Additive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Shengyi, Kb, Nanya, Ilm
Criteria
Aql II 0.65
Hole Sizes
0.3mm
Bevel Edge
Yes
Impedance
50/90/100 Ohm
Trace Width(Min.)
8mil
Surfaec Treatment
HASL
Transport Package
Vacuum Packaging
Specification
100*220mm
Trademark
XMANDA
Origin
Made in China
HS Code
8534009000
Production Capacity
50000sqm/Month

Product Description

Versatile Dual-Sided Power Distribution BoardVersatile Dual-Sided Power Distribution BoardVersatile Dual-Sided Power Distribution BoardVersatile Dual-Sided Power Distribution BoardVersatile Dual-Sided Power Distribution Board


Specifications:

Layers: 2
Thickness: 0.6-1.6mm
Material: FR4 KB6160
Size: 100*220mm
Surface treatment:HASL
Line width/spacing: 8/8mil
Minimum aperture: 0.30mm
Solder mask color: Red
Finished copper thickness: 1/1OZ

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.
2. Made of TG140 material


Shenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthly
One-stop solutions for clients (PCB & PCBA)
Over 12 years of Experience in PCBs
Avg Response time: ≤24 h (experienced Engineers to Serve you)
Comply with RoHS,TS16949,ISO9001 and UL certifications.
Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

 

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.

High-quality Raw Material

★Traceable source of branded raw material
★Standardized procurement process
★Strict supplier selection policy

Production Equipment
★High precision processing equipment
★Efficient operation guarantees quality
★Meet various special technical processes

Intelligent System
★Intelligent audition
★Intelligent CAM
★Intelligent paneling
★Intelligent production

Strict Inspection
★100% AOI testing
★100% FQA/FQC
★Quality Control
★'Failed One Lost Ten'

 
Our Capabilities and Technology
Items 2022 2023
Layers (MP):22layer,(Sampling):32 layer (MP):32layer
Max. Board THK Sampling 4.0mm / MP :3.2mm Sampling 5.0mm / MP:3.2mm
Min. Board THK Sampling :0.4mm /MP :0.5mm Sampling: 0.3mm / MP:0.4mm
Base copper Inner layer 1/3 ~ 6OZ 1/3~8 OZ
Outer layer 1/3 ~ 6 OZ 1/3 ~ 8 OZ
Borehole diameter Min.PTH 0.2mm 0.15mm
Max. aspect ratio 10:01 12:01
HDI aspect ratio 0.8:1 1:01
Tolerances   PTH ±0.076mm ±0.05mm
  NPTH ±0.05mm ±0.03mm
Solder mask opening 0.05mm 0.03mm
Solder dam (Green) 0.076mm , (Green) 0.076mm ,
(other color) 0.1mm (other color) 0.08mm
Min. core THK. 0.1mm 0.08mm
Bow&twist ≤0.5% ≤0.5%
Routing Tol.  Sampling :±0.075mm /MP:±0.1mm Sampling:±0.075mm /MP:±0.075mm
Impedance Tol. ±10% ±8%
Min. w/s (Inner layer) 0.075 / 0.075mm 0.075 / 0.075mm
Min. w/s (Outer layer) 0.075 / 0.075mm 0.075 / 0.075mm
 (Min. BGA size) 0.2mm 0.15mm
(pitch)(Min. BGA Pitch) 0.65mm 0.5mm
(Working panel size) 600mm*700mm 600mm*700mm
Special process Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. 



 

 

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